1/9 www.rohm.com 2011.06 - rev.c ? 2011 rohm co., ltd. all rights reserved. power management switch ics for pc s and digital consumer products load switch ic for portable equipment bd6524hfv description power switch for memory card slot (bd6524hfv) is a high side switch ic having one circuit of n-channel power mos fet. the switch realizes 200m ? (typ.) on resistance. operations from low input voltage (vin 3.0v) can be made for use for various switch applications. the switch turns on slowly by the built-in charge pump, therefore, it is possible to re duce inrush current at switch on. there is no parasitic diode between the drain and the source, reverse cu rrent flow at switch off is prevented. further, it has a discharge circuit that discharges electric charge from capacitive load at switch off. the bd6524hfv is available in a space-saving hvsof6 package. features 1) low on resistance (200m ? , typ.) n-mos switch built in 2) maximum output current : 500ma 3) soft start circuit 4) under voltage lockout (uvlo) circuit 5) discharge circuit built in : operations at switch off, uvlo 6) reverse current flow blocking at switch off applications memory card slots of notebook pc, digital still camera, portable music player, compact portable devices such as pda and so fort h absolute maxi mum ratings parameter symbol ratings unit supply voltage v in -0.3 to 6.0 v control input voltage v en -0.3 to v in + 0.3 v switch output voltage v out -0.3 to 6.0 v storage temperature t stg -55 to 150 power dissipation pd 510 *1 mw *1 derating : 4.08mw/ for operation above ta = 25 . * this product is not designed for protection against radioactive rays. * operation is not guaranteed. operation conditions parameter symbol ratings unit supply voltage v in 3.0 to 5.5 v operating temperature t opr -25 to 75 switch current i out 500 ma no.11029ect13
bd6524hfv technical note 2/9 www.rohm.com 2011.06 - rev.c ? 2011 rohm co., ltd. all rights reserved. electrical characteristics unless otherwise specified, ta = 25 , v in = 5v, parameter symbol limits unit condition min. typ. max. operating current i dd - 50 75 a v en = 5v, vout = open standby current i stb - 0.1 1 a v en = 0v, vout = open en input voltage v enh - - 2.5 v high level input voltage v enl 0.7 - - v low level input voltage en input leak current i en -1 0.01 1 a switch on resistance r on - 200 255 m ? v in = 5v - 250 335 m ? v in = 3.3v switch leak current i leak - - 10 a at switch off switch rise time t on1 - 0.4 0.8 ms rl=10 ? . refer to the timing diagram in fig. 2. switch rise delay time t on2 - 0.5 1.0 ms rl=10 ? . refer to the timing diagram in fig. 2. switch fall time t off1 - 1 2 us rl=10 ? . refer to the timing diagram in fig. 2. switch fall delay time t off2 - 2 4 us rl=10 ? . refer to the timing diagram in fig. 2. uvlo threshold voltage v uvlo 1.9 2.2 2.5 v v in increasing 1.8 2.1 2.4 v v in decreasing discharge resistance r disc - 200 350 ? v en = 0v, i l = 1ma discharge current i disc 0.8 1.8 - ma v en = 0v,v in = v out = 1.8v measurement circuit fig.1 measurement circuit timing diagram fig.2 timing diagram t on2 t on1 10% 90% 50% 50% 90% 10% t off2 t off1 vout ven rl vin vout en gnd vin cl vout
bd6524hfv technical note 3/9 www.rohm.com 2011.06 - rev.c ? 2011 rohm co., ltd. all rights reserved. 0.0 0.5 1.0 1.5 2.0 2.5 -25 0 25 50 75 ambient temperature:ta[ ] en input voltage:v enl [v] 0 50 100 150 200 250 300 350 - 25 0 25 50 75 ambient temperature:ta[ ] on resistance:r on [mo] 0 5 10 15 20 25 30 35 40 45 50 -25 0 25 50 75 ambient temperature:ta[ ] operating current:i dd [ua] 0.0 0.5 1.0 1.5 2.0 2.5 -25 0 25 50 75 ambient tempetrature:ta[ ] en input voltage:v enh [v] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 -25 0 25 50 75 ambient temperature:ta[ ] turn off time1:t off1 [us] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 -25 0 25 50 75 ambient temperature:ta[ ] turn off time2:t off2 [us] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -25 0 25 50 75 ambient temperature:ta[ ] uvlo threshold:v uvlo [v] 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 -25 0 25 50 75 ambient temperature:ta[ ] turn on time1:t on1 [ms] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 -25 0 25 50 75 ambient temperature:ta[ ] turn on time2:t on2 [ms] 0.00 0.02 0.04 0.06 0.08 0.10 -25 0 25 50 75 ambient temperature:ta[ ] stand-by current:i stb [ua] 0 50 10 0 15 0 20 0 25 0 -25 0 25 50 75 ambi ent tempe rature :ta [ ] discharge resistance:r disc [ ? ] h typical characteristics from above :v in =3.0v,5.0v,5.5v fig.9 switch rise delay time fig.3 operating current fig.4 standby current fig.13 discharge resistance fig.12 uvlo threshold voltage fig.5 en threshold voltage (high level input voltage fig.6 en threshold voltage (low level input voltage) fig.7 switch on resistance fig.8 switch rise time fig.10 switch fall time fig.11 switch fall delay time from above: v in =3.0v,5.0v,5.5v from above: vin=3.0v,4.0v,5.0v,5.5v from above: vin=3.0v,4.0v,5.0v,5.5v from above: vin=3.0v,4.0v,5.0v,5.5v from above: v in =5.5v,5.0v,3.0v from above: v in =5.5v,5.0v,3.0v from above: v in =3.0v,5.0v,5.5v v in increasing v in decreasing from above: vin=3.0v,4.0v,5.0v,5.5v
bd6524hfv technical note 4/9 www.rohm.com 2011.06 - rev.c ? 2011 rohm co., ltd. all rights reserved. 0 5 10 15 20 25 30 35 40 45 50 3.0 3.5 4.0 4.5 5.0 5.5 input voltage:v in [v] operating current:i dd [ua] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 3455.5 input voltage:v in [v] turn off time:t off [us] 0 50 100 150 200 250 300 350 3.0 3.5 4.0 4.5 5.0 5.5 input voltage:v in [v] on resistance:r on [m ] 0 50 100 150 200 250 3 3.5 4 4.5 5 5.5 input voltage:v in [v] discharge resistance:r disc [ ] 0.0 0.5 1.0 1.5 2.0 2.5 33.544.555.5 input voltage:v in [v] en input voltage:v en [v] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 3455.5 input voltage:v in [v] turn on time:t on [ms] fig.14 operating current fi g.15 en threshold voltage fig.19 discharge resistance fig.16 switch on resistance fig.17 switch rise time fig.18 switch fall time t on1 t on2 t off1 t off2 v enh v enl
bd6524hfv technical note 5/9 www.rohm.com 2011.06 - rev.c ? 2011 rohm co., ltd. all rights reserved. waveform data v out (1v/div) v out (1v/div) v out (1v/div) en (1v/div) en (1v/div) en (1v/div) v out (1v/div) en (1v/div) fig.20 switch rise time fi g .21 switch fall time fig.22 switch rise time fig.23 switch fall time fig.24 inrush current fig.25 inrush current fig.26 uvlo cl = 10uf fig.27 uvlo cl = 1uf 1.10ms 0.42ms 1.05ms 0.74ms irush (50ma/div) en (5v/div) v out (1v/div) v in (1v/div) 50ms v out (1v/div) v in (1v/div) 5ms time (100us/div) time (100us/div) time (20ms/div) time (20ms/div) time (500us/div) time (200us/div) time (500us/div) time (200us/div) irush (50ma/div) en (5v/div) cl = 10uf cl = 4.7uf cl = 1uf cl = 10uf cl = 4.7uf cl = 1uf rl=10 ? , cl=10uf v in = 5v rl=10 ? , cl=10uf v in = 3v rl=10 ? , cl=10uf v in = 3v rl=10 ? , cl=10uf v in = 5v v in = 5v v in = 3v
bd6524hfv technical note 6/9 www.rohm.com 2011.06 - rev.c ? 2011 rohm co., ltd. all rights reserved. block diagram pin description pin no. symbol pin function 1 vin switch input pin. at use, connect each pin outside. 2 3 en switch control input pin (hysteresis input) switch on at high. 4 gnd ground 5 vout switch output pin at use, connect each pin outside. 6 i/o circuit fig.30 i/o circuit fig.29 block diagram fig.28 pin configuration en charge pump control logic vin vout gnd 1,2 4 3 5,6 vin vout en gnd vin vout 1 2 34 5 6 vin en vout vin
bd6524hfv technical note 7/9 www.rohm.com 2011.06 - rev.c ? 2011 rohm co., ltd. all rights reserved. functional description 1. input / output vin pin and vout pin are connected to the drain and the sour ce of n-mos switch respectively. and the vin pin is used also as power source input to internal control circuit. when en input is set to high level and the switch is turned on, vin pin and vout pin are connected by a 200m ? switch. in a normal condition, current flows from vin to vout. if volt age of vout is higher than vin, current flows from vout to vin, since the switch is bidirectional. there is not a parasitic diode between the drain and the source, it is possible to prevent current from flowing reversely from vout pin to vin pin when the switch is disabled. 2. discharge circuit when the switch between the vin and the vout is off, the 200 ? (typ.) discharge switch between vout and gnd turns on. by turning on this switch, electric charge at capacitive load is discharged. 3. under voltage lockout (uvlo) the uvlo circuit monitors the voltage of the vin pin, when t he en input is active. uvlo circuit prevents the switch from turning on until the v in exceeds 2.2v(typ.). if the vin drops below 2.1v(t yp.) while the switch turns on, then uvlo shuts off the switch. while the switch between the vin pin and vout pin is off owing to uvlo operatio ns, the switch of the discharge circuit turns on. however, when the voltage of vin declines extremely, then the vout pin becomes hi-z. fig.31 operation timing typical application circuit fig.32 typical application circuit on off on off on off ven vout vin |50 2.1v(typ.) 2.2v(typ.) vin vout en gnd vin vout en load 0.1 c> 1uf discharge circuit
bd6524hfv technical note 8/9 www.rohm.com 2011.06 - rev.c ? 2011 rohm co., ltd. all rights reserved. notes for use (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify break ing mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assu med, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characte ristics can be provided approximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can break do wn ics. take protective m easures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and t he gnd lines.in this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for t he analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thor oughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capaci ty dropout at a low temperat ure, thus determining the constant. (5) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient. (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of t he ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or t he gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong elec tromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connec ted to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each proc ess. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to tu rn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then dismount it from the jig. in addition, for protection against static electricity, establish a ground for the assembly pr ocess and pay thorough attention to the transportation and the stor age of the set pcb. (9) input terminals in terms of the construction of ic, parasitic elements are inev itably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunct ion and then breakdown of the input terminal. therefore, pay thorough attention not to handle t he input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a volt age lower than the power supply voltag e or within the guaranteed value of electrical characteristics. (10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluc tuations in voltages of the small-signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. (11) external capacitor in order to use a ceramic capacitor as the external capaci tor, determine the constant with consideration given to a degradation in the nominal capacitance due to dc bias and c hanges in the capacitance due to temperature, etc. (12) thermal design perform thermal design in which there are adequate margins by taking into account the power dissipation (pd) in actual states of use.
bd6524hfv technical note 9/9 www.rohm.com 2011.06 - rev.c ? 2011 rohm co., ltd. all rights reserved. ordering part number b d 6 5 2 4 h f v - t r part no. part no. 6524 package hfv: hvsof6 packaging and forming specification tr: embossed tape and reel (hvsof6) (unit : mm) hvsof6 0.1 s s (1.2) (1.4) (1.5) (0.45) (0.15) 0.1450.05 0.220.05 0.75max. 0.5 321 456 3.0 0.1 2.6 0.1 1.60.1 (max 1.8 include burr) (max 2.8 include burr) direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin
r1120 a www.rohm.com ? 2011 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specified herein is subject to change for improvement without notice. the content specified herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specifications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specified in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specified in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any product, such as derating, redundancy, fire control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specified herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.
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